【预订】Nanoscale Devices 9780367570729
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/ 2020-06-30
Product Details 基本信息 ISBN-13 书号 9780367570729 Author 作者 Brajesh Kumar Kaushik Format 版本 平装-胶订 Pages Number 页数 452页 Publisher 出版社 CRC Press Publication Date 出版日期 2020-06-30 Shipping Weight 商品重量 840g Language 语种 英语 Book Contents 内容简介 The primary aim of this book is to discuss various aspects of nanoscale device design and their applications including transport mechanism, modeling, and circuit applications. .Provides a platform for modeling and analysis of state-of-the-art devices in nanoscale regime, reviews issues related to optimizing the sub-nanometer device performance and addresses simulation aspect and/or fabrication process of devicesAlso, includes design problems at the end of each chapter
¥561.00
【预订】Soil Carbon Storage 9780128127667
美国库房发货,通常付款后3-5周到货!
/ 2018-04-18
/ 暂无出版社信息
Product Details 基本信息 ISBN-13 书号 9780128127667 Author 作者 Singh, Brajesh Format 版本 平装-胶订 Pages Number 页数 248页 Publication Date 出版日期 2018-04-18 Language 语种 英语 Book Contents 内容简介 Soil Carbon Storage: Modulators, Mechanisms and Modeling takes a novel approach to the issue of soil carbon storage by considering soil C sequestration as a function of the interaction between biotic (e.g. microbes and plants) and abiotic (climate, soil types, management practices) modulators as a key driver of soil C. These modulators are central to C balance through their processing of C from both plant inputs and native soil organic matter. This book considers this concept in the light of state-of-the-art methodologies that elucidate these interactions and increase our understanding of a vitally important, but poorly characterized component of the global C cycle. The book provides soil scientists with a co
¥1051
【预订】Through Silicon Vias 9781498745529
美国库房发货,通常付款后3-5周到货!
/ 2016-08-26
Product Details 基本信息 ISBN-13 书号 9781498745529 Author 作者 Brajesh Kumar Kaushik Format 版本 精装 Pages Number 页数 232页 Publisher 出版社 CRC Press Publication Date 出版日期 2016-08-26 Language 语种 其它(含多语) Book Contents 内容简介 Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
¥2059
【预订】Organic Thin-Film Transistor Applications 9780367574611
国外库房发货,通常付款后3-5周到货!
/ 2020-06-30
Product Details 基本信息 ISBN-13 书号 9780367574611 Author 作者 Brajesh Kumar Kaushik Format 版本 平装-胶订 Pages Number 页数 372页 Publisher 出版社 CRC Press Publication Date 出版日期 2020-06-30 Shipping Weight 商品重量 690g Language 语种 英语 Book Contents 内容简介 Text provides information about advanced OTFT (Organic thin film transistor) structures, their modeling and extraction of performance parameters, materials of individual layers, their molecular structures, basics of pi-conjugated semiconducting materials and their properties, OTFT charge transport phenomena and fabrication techniques. It includes applications of OTFTs such as single and dual gate OTFT based inverter circuits along with bootstrap techniques, SRAM cell designs based on different material and circuit configurations, light emitting diodes (LEDs). Besides this, application of dual gate OTFT in the logic gate, shift reg
¥578.00
【预订】Nanoscale Devices 9781138060340
美国库房发货,通常付款后3-5周到货!
/ 2018-11-29
Product Details 基本信息 ISBN-13 书号 9781138060340 Author 作者 Brajesh Kumar Kaushik Format 版本 精装 Pages Number 页数 472页 Publisher 出版社 CRC Press Publication Date 出版日期 2018-11-29 Language 语种 其它(含多语) Book Contents 内容简介 The aim of this book is to discuss various aspects of nanoscale devices design and their applications including transport mechanism, modeling, and circuit applications. Furthermore, the book develops a strong foundation to understand the need for moving from conventional MOSFET to the novel devices.
¥1498
【预订】Organic Thin-Film Transistor Applications 9781498736534
美国库房发货,通常付款后3-5周到货!
/ 2016-08-22
Product Details 基本信息 ISBN-13 书号 9781498736534 Author 作者 Brajesh Kumar Kaushik Format 版本 精装 Pages Number 页数 372页 Publisher 出版社 CRC Press Publication Date 出版日期 2016-08-22 Language 语种 其它(含多语) Book Contents 内容简介 Text provides information about advanced OTFT (Organic thin film transistor) structures, their modeling and extraction of performance parameters, materials of individual layers, their molecular structures, basics of pi-conjugated semiconducting materials and their properties, OTFT charge transport phenomena and fabrication techniques. It includes applications of OTFTs such as single and dual gate OTFT based inverter circuits along with bootstrap techniques, SRAM cell designs based on different material and circuit configurations, light emitting diodes (LEDs). Besides this, application of dual gate OTFT in the logic gate, shift register, Flip-Flop, counter circui
¥1579
【预订】Nanoelectronics 9780128133538
美国库房发货,通常付款后3-5周到货!
/ 2018-10-10
/ 暂无出版社信息
Product Details 基本信息 ISBN-13 书号 9780128133538 Author 作者 Kaushik, Brajesh Kumar Format 版本 平装-胶订 Pages Number 页数 352页 Publication Date 出版日期 2018-10-10 Language 语种 英语 Book Contents 内容简介 Nanoelectronics: Devices, Circuits and Systems explores current and emerging trends in the field of nanoelectronics, from both a devices-to-circuits and circuits-to-systems perspective. It covers a wide spectrum and detailed discussion on the field of nanoelectronic devices, circuits and systems. This book presents an in-depth analysis and de*ion of electron transport phenomenon at nanoscale dimensions. Both qualitative and analytical approaches are taken to explore the devices, circuit functionalities and their system applications at deep submicron and nanoscale levels. Recent devices, including FinFET, Tunnel FET, and emerging materials, including graphene, and its applications are discussed. In add
¥1534
【预订】API Management 9781484213063
美国库房发货,通常付款后3-5周到货!
/ 2017-03-20
/ Apress
Product Details 基本信息 ISBN-13 书号 9781484213063 Author 作者 Brajesh De Format 版本 平装-胶订 Pages Number 页数 195页 Publisher 出版社 Apress Publication Date 出版日期 2017-03-20 Product Dimensions 商品尺寸 9.2 x 6.1 x 0.4 cm Shipping Weight 商品重量 343g Language 语种 英语 Book Contents 内容简介 Maximize the impact of your assets and business services by providing APIs for developers and other users. The journey described in this book starts with identifying business assets. As part of the API team, you then need to identify and define the requirements of traffic management, security, mediation, and orchestration. You also must define metrics for the analytics to measure the success of the overall API program. API documentation and the ease of developer onboarding also determine the success of the APIs. Finally, monetization of these APIs leads to revenue generation for the enter
¥528.00
【预订】Biocomposites 9781839690808
国外库房发货,通常付款后3-5周到货!
2022-03-30
/ Intech
Product Details 基本信息 ISBN-13 书号 9781839690808 Author 作者 Brajesh Kumar Format 版本 精装 Pages Number 页数 168页 Publisher 出版社 Intech Publication Date 出版日期 2022-03-30 Language 语种 其它(含多语) Book Contents 内容简介 Biocomposites are composite materials consisting of either a polymer matrix or a filler based on biological resources. They have been widely used in numerous applications such as storage devices, photocatalysts, packaging, furniture, biosensors, energy, construction, the automotive industry, and so on due to their great versatility and satisfactory performance. This book focuses on composites made from natural materials (natural fibers and biopolymers) and relates their physical, mechanical, electrical, structural, and biological characteristics as well as their potential applications in biomedicine, pharmaceuticals, and engineering.
¥1430
【预订】Through Silicon Vias 9780367574543
国外库房发货,通常付款后3-5周到货!
/ 2020-06-30
Product Details 基本信息 ISBN-13 书号 9780367574543 Author 作者 Brajesh Kumar Kaushik Format 版本 平装-胶订 Pages Number 页数 232页 Publisher 出版社 CRC Press Publication Date 出版日期 2020-06-30 Shipping Weight 商品重量 430g Language 语种 英语 Book Contents 内容简介 Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
¥559.00
【预订】Green Chemistry - New Perspectives 9781803557779
国外库房发货,通常付款后3-5周到货!
/ 2022-12-14
/ Intech
Product Details 基本信息 ISBN-13 书号 9781803557779 Author 作者 Brajesh Kumar Format 版本 精装 Pages Number 页数 268页 Publisher 出版社 Intech Publication Date 出版日期 2022-12-14 Language 语种 其它(含多语) Book Contents 内容简介 Green Chemistry - New Perspectives is at the frontiers of this continuously evolving interdisciplinary science, and publishes research that attempts to reduce the environmental impact of the chemical enterprise by developing a technology base that is inherently non-toxic to living things and the environment. The book covers all aspects of green chemistry, including chemical synthesis, nano synthesis, eco-friendly processes, biomass, extraction techniques, environmental remediation, and energy, making it a unique reference resource. This will continue to encourage scientists around the world to develop novel synthetic methods or improve the existing ones to circumvent some
¥1320
【预订】Spacer Engineered FinFET Architectures 9781498783590
美国库房发货,通常付款后3-5周到货!
/ 2017-06-06
Product Details 基本信息 ISBN-13 书号 9781498783590 Author 作者 Sudeb Dasgupta, Brajesh Kumar Kaushik and Pankaj Kumar Pal Format 版本 精装 Pages Number 页数 154页 Publisher 出版社 CRC Press Publication Date 出版日期 2017-06-06 Language 语种 其它(含多语) Book Contents 内容简介 This book focuses towards the spacer engineering aspects of novel MOS-based device-circuit co-design in sub-20nm technology node, its process complexity, variability and reliabilities issues. This book comprehensively explores the FinFET/tri-gate architectures with their circuit/SRAM suitability and tolerance to random statistical variations. This book concentrates on last ten years of cutting-edge research on high-permittivity materials and its usage in FinFETs either as gate-dielectric or spacer engineering. It specifically targets spacer engineering, discussing its pros and cons with FinFETs covers complete device to circu
¥1541