【预订】Functional Metamaterials and Metadevices (2018) 97833196
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/ 2017-09-22
/ Springer
Product Details 基本信息 ISBN-13 书号 9783319660431 Author 作者 Tong, Xingcun Colin Format 版本 精装 Publisher 出版社 Springer Publication Date 出版日期 2017-09-22 Language 语种 英语
¥1557
【预订】Advanced Materials and Design for Electromagnetic Interf
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/ 2008-11-19
Product Details 基本信息 ISBN-13 书号 9781420073584 Author 作者 Xingcun Colin Tong Format 版本 精装 Pages Number 页数 344页 Publisher 出版社 CRC Press Publication Date 出版日期 2008-11-19 Shipping Weight 商品重量 612g Language 语种 英语 Book Contents 内容简介 Exploring the role of EMI shielding in EMC design, this book introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding. It reviews effective shielding measuring methods, surface finish, corrosion protection and galvanic compatibility, and environmental compliance. The author covers a wide array of issues in advanced shielding materials and design solutions, including enclosures, conductive elastomer and flexible graphite components, and composites. He also discusses future trends for the development of more efficient and more reliable materials and d
¥1907
【预订】Advanced Materials for Integrated Optical Waveguides 978
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/ 2016-08-23
Product Details 基本信息 ISBN-13 书号 9783319375038 Author 作者 Xingcun Colin Tong Ph.D Format 版本 平装-胶订 Pages Number 页数 552页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2016-08-23 Shipping Weight 商品重量 1016g Language 语种 英语 Book Contents 内容简介 This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to
¥1560
【预订】Functional Metamaterials and Metadevices 9783319881621
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/ 2018-08-22
Product Details 基本信息 ISBN-13 书号 9783319881621 Author 作者 Xingcun Colin Tong Format 版本 平装-胶订 Pages Number 页数 277页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2018-08-22 Language 语种 英语 Book Contents 内容简介 To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial syste
¥1538
【预订】Advanced Materials for Thermal Management of Electronic
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/ Springer
¥3392.9
【预订】Advanced Materials for Thermal Management of Electronic
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/ 1988-08-08
/ Springer
¥1614
电子封装热管理先进材料 [美] 仝兴存(Xingcun,Colin,Tong) 著,安兵,吕卫 国防工业出版社 9787
2016-04-01
/ 国防工业出版社
¥1677定价:¥3354(5折)
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电子封装热管理先进材料[美]仝兴存(Xingcun,Colin,Tong)国防工业出版社【现货实拍 可开发票 下单速发
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/ 2016-04-01
/ 国防工业出版社
¥798.00定价:¥2394(3.34折)
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