【预订】Technology Leadership for Innovation in Higher Education
美国库房发货,通常付款后3-5周到货!
/ 2019-01-30
Product Details 基本信息 ISBN-13 书号 9781522577690 Author 作者 Yufeng Qian^^Guiyou Huang Format 版本 精装 Pages Number 页数 285页 Publisher 出版社 IGI Publishing Publication Date 出版日期 2019-01-30 Language 语种 英语 Book Contents 内容简介 Higher education today faces several challenges including soaring cost, rising student debt, declining state support, and a staggering dropout rate. Digital technology enables numerous paths to innovation and promising solutions to these crises in higher education. However, few efforts have been made to look into the dynamic relationship between technology, innovation, and leadership and how they work together to transform teaching and learning, campus life, student service and support, administration, and university advancement. Technology Leadership for Innovation in Higher Education is a pivotal reference source that provides vital research on the intersection of t
¥1518
【预订】Principles and Applications of Therapeutic Ultrasound in
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/ 2021-03-30
Product Details 基本信息 ISBN-13 书号 9780367658663 Author 作者 Yufeng Zhou Format 版本 平装-胶订 Pages Number 页数 364页 Publisher 出版社 CRC Press Publication Date 出版日期 2021-03-30 Language 语种 英语 Book Contents 内容简介 Therapeutic uses of ultrasound include fragmentation of kidney stones, ablation of tumors and newer applications, such as drug delivery and denervation. Suitable as a textbook or as a quick reference for medical device engineers, research scientists, and healthcare professionals, this text systemically introduces the concepts, principles, constr
¥573.00
【预订】Teaching, Learning, and Leading With Computer Simulation
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/ 2019-09-30
Product Details 基本信息 ISBN-13 书号 9781799800040 Author 作者 Yufeng Qian Format 版本 精装 Pages Number 页数 350页 Publisher 出版社 IGI Publishing Publication Date 出版日期 2019-09-30 Product Dimensions 商品尺寸 10 x 7 x 0.8 cm Language 语种 英语 Book Contents 内容简介 Computer simulation, a powerful technological tool and research-proven pedagogical technique, holds great potential to enhance and transform teaching and learning in education and is therefore a viable tool to engage students in deep learning and higher-order thinking. With the advancement of simulation technology (e.g., virtual reality, artificial intelligence, machine learning) and the expanded disciplines where computer simulation is being used (e.g., data science, cyber security), computer simulation is playing an increasingly significant role in leading the digital transformation in K-12 schools and higher education institu
¥1655
【预订】Collaborative Perception, Localization and Mapping for A
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/ 2020-12-21
Product Details 基本信息 ISBN-13 书号 9789811588594 Author 作者 Yue Yufeng Format 版本 精装 Pages Number 页数 142页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2020-12-21 Language 语种 英语 Book Contents 内容简介 This book presents the breakthrough and cutting-edge progress for collaborative perception and mapping by proposing a novel framework of multimodal perception-relative localization–collaborative mapping for collaborative robot systems. The organization of the book allows the readers to analyze, model and design collaborative perception technology for autonomous robots. It presents the basic foundation in the field of collaborative robot systems and the fundamental theory and technical guidelines for collaborative perception and mapping. The book significantly promotes the development of autonomous systems from individual intelligence to collaborative intelligence by p
¥1216
【预订】Introduction to Microsystem Packaging Technology 9781439
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/ 2010-09-29
Product Details 基本信息 ISBN-13 书号 9781439819104 Author 作者 Yufeng Jin Format 版本 精装 Pages Number 页数 232页 Publisher 出版社 CRC Press Publication Date 出版日期 2010-09-29 Shipping Weight 商品重量 680g Language 语种 英语 Book Contents 内容简介 Purposefully organized in independent chapters, the book systematically presents the widest possible overview of packaging knowledge. It illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. It also details 3D-package and system-level package development with a decidedly MEMS perspective. Integrating the work of international engineers, this book presents a diversity of technologies in relation to MSP. Other topics in include encapsulation and sealing and system-in-package, device-level and optoelectronics packaging, and modular assembly, inspection, and reliabil
¥2138
预订 New Mechanism Used in Standing Wheelchair 9783659612732
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/ 2014-09-24
图书信息 书号: 9783659612732 作者: Sun Yufeng 装帧: 平装-胶订 页数: 80页 出版社: Omnium Gmbh & Co. Kg. 尺寸: 0.9 x 0.6 x 22.8 cm 出版日期: 2014-09-24 重量: 127g 语种: 其它(含多语) 内容简介 With the development of Swedish society, many people and organizati
¥380.00
【预订】Magnesium Alloys as Degradable Biomaterials 978146659804
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/ 2015-10-09
Product Details 基本信息 ISBN-13 书号 9781466598041 Author 作者 Yufeng Zheng Format 版本 精装 Pages Number 页数 600页 Publisher 出版社 CRC Press Publication Date 出版日期 2015-10-09 Shipping Weight 商品重量 952g Language 语种 其它(含多语) Book Contents 内容简介 This book provides a comprehensive review of the biomedical applications of biodegradable magnesium and its alloys. It discusses the basic concepts of biodegradation mechanisms as well as the strategy to control biodegradation mode and rate, microstructure, mechanical properties, corrosion resistance to body fluid, and in vitro and in vivo biocompatibility. Challenges of transitioning biodegradable magnesium alloys from raw materials to semi-products to final medical devices are covered, along with main findings of worldwide experimental studies. An ideal reference book for researchers in the area of biodegradable metals, it presen
¥2158
【预订】Technology Leadership for Innovation in Higher Education
美国库房发货,通常付款后3-5周到货!
/ 2019-02-28
Product Details 基本信息 ISBN-13 书号 9781522586104 Author 作者 Yufeng Qian Format 版本 平装-胶订 Pages Number 页数 351页 Publisher 出版社 IGI Publishing Publication Date 出版日期 2019-02-28 Language 语种 英语 Book Contents 内容简介 Higher education today faces several challenges including soaring cost, rising student debt, declining state support, and a staggering dropout rate. Digital technology enables numerous paths to innovation and promising solutions to these crises in higher education. However, few efforts have been made to look into the dynamic relationship between technology, innovation, and leadership and how they work together to transform teaching and learning, campus life, student service and support, administration, and university advancement. Technology Leadership for Innovation in Higher Education is a pivotal reference source that provides vital research on the intersection of technolo
¥1149
【预订】Device-to-Device based Proximity Service 9781498724173
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/ 2017-07-14
/ 暂无出版社信息
Product Details 基本信息 ISBN-13 书号 9781498724173 Author 作者 Yufeng Wang, Athanasios V. Vasilakos, Qun Jin and Hongbo Zhu Format 版本 精装 Pages Number 页数 560页 Publication Date 出版日期 2017-07-14 Language 语种 英语 Book Contents 内容简介 D2D-based proximity service is a very hot topic with great commercial potential from an application standpoint. Unlike existing books which focus on D2D communications technologies, this book fills a gap by summarizing and analyzing the latest applications and research results in academic, industrial fields, and standardization. The authors present the architecture, fundamental issues, and applications in a D2D networking environment from both application and interdisciplinary points of view.
¥2272
【预订】Collaborative Perception, Localization and Mapping for A
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/ 2021-11-14
Product Details 基本信息 ISBN-13 书号 9789811588624 Author 作者 Yufeng Yue Format 版本 平装-胶订 Pages Number 页数 141页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2021-11-14 Product Dimensions 商品尺寸 9.2 x 6.1 x 0.3 cm Shipping Weight 商品重量 500g Language 语种 其它(含多语) Book Contents 内容简介 This book presents the breakthrough and cutting-edge progress for collaborative perception and mapping by proposing a novel framework of multimodal perception-relative localization–collaborative mapping for collaborative robot systems. The organization of the book allows the readers to analyze, model and design collaborative perception technology for autonomous robots. It presents the basic foundation in the field of collaborative robot systems and the fundamental theory and technical guidelines for collaborative perception and mapping. The book signif
¥1197
【预订】Value Creation through Engineering Excellence 9783319858
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/ 2018-08-23
Product Details 基本信息 ISBN-13 书号 9783319858883 Author 作者 Yufeng Zhang University of Birmingham Edgbaston Birmingha Format 版本 平装-胶订 Pages Number 页数 375页 Publisher 出版社 Palgrave Macmillan Publication Date 出版日期 2018-08-23 Language 语种 英语 Book Contents 内容简介 This book provides a systematic framework for effectively creating value through engineering in global business networks, and contributes to an increasingly important branch of engineering operations. By updating the traditional disciplines of engineering and operations management and addressing challenges and opportunities in building global network capabilities, this study offers a contemporary guide for developing effective industrial policies to enhance the global competitiveness of engineering sectors, which will be extremely useful to engineering companies and policy-makers. Themes discussed include main trends and d
¥1288
预订 Teaching, Learning, and Leading With Computer S... 978179
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/ 2019-07-29
图书信息 书号: 9781799800040 作者: Yufeng Qian 装帧: 精装 页数: 350页 出版社: IGI Global 尺寸: 25.4 x 17.8 x 2.5 cm 出版日期: 2019-07-29 重量: 908g 语种: 其它(含多语) 内容简介 Computer simulation, a powerful technological tool and research-proven pedagogical
¥2115
【预订】Access Surgery: A Review of Current Techniques for Vascu
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/ 2011-10-19
/ 暂无出版社信息
¥677.00
预售 按需印刷 Integrating Multi User Virtual Environment在现代教室中集成多用
北京发货,付款后10天内发货
/ 2018-01-26
/ IGI出版社
¥1419
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【预订】Device-to-Device based Proximity Service 9780367573348
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/ 2020-06-30
Product Details 基本信息 ISBN-13 书号 9780367573348 Author 作者 Yufeng Wang Format 版本 平装-胶订 Pages Number 页数 500页 Publisher 出版社 CRC Press Publication Date 出版日期 2020-06-30 Shipping Weight 商品重量 930g Language 语种 英语 Book Contents 内容简介 D2D-based proximity service is a very hot topic with great commercial potential from an application standpoint. Unlike existing books which focus on D2D communications technologies, this book fills a gap by summarizing and analyzing the latest applications and research results in academic, industrial fields, and standardization. The authors present the architecture, fundamental issues, and applications in a D2D networking environment from both application and interdisciplinary points of view.
¥599.00
【预订】Spacecraft Maneuver with Performance Guaranteed 97898199
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2023-09-12
Product Details 基本信息 ISBN-13 书号 9789819946525 Author 作者 Yufeng Gao Format 版本 精装 Pages Number 页数 385页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2023-09-12 Language 语种 其它(含多语) Book Contents 内容简介 Facing future-oriented aerospace applications, large-scale space construction and on-orbit services have rapidly developed. In such emerging and increasingly complex spacecraft maneuvering and control tasks, more precise control accuracy and higher performance guarantees need to be fully considered due to the need for safe close rendezvous movements.This book is dedicated to solving the aerospace system’s performance guaranteed and precise control challenges with the expected transient and strict steady-state constraints. It is designed so that the aerospace closed-loop system can theoretically meet the pre-defined or prescribed performance requirements
¥1664
预售 按需印刷 Teaching, Learning, and Leading With Compu使用计算机模拟进行教
北京发货,付款后10天内发货
/ 2019-09-20
/ IGI出版社
¥1265.25
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【预订】Integrating Multi-User Virtual Environments in Modern Cl
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/ 2018-01-26
/ 暂无出版社信息
Product Details 基本信息 ISBN-13 书号 9781522537199 Author 作者 Yufeng Qian Format 版本 精装 Pages Number 页数 300页 Publication Date 出版日期 2018-01-26 Product Dimensions 商品尺寸 11 x 8.5 x 0.8 cm Shipping Weight 商品重量 2550g Language 语种 英语 Book Contents 内容简介 As innovation advances and grows, classrooms are able utilize more advanced technology to educate students. Through virtual learning environments, students can experience real-life tasks and situations more directly, promoting active engagement in education.Integrating Multi-User Virtual Environments in Modern Classrooms provides emerging research on the development of multi-user virtual learning environments and their potential role in education. Highlighting a range of pertinent topics, such as project-based learning, social learning theory, and interactive media, this book is a vital resource for educational researchers, sc
¥1539
先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
/ 2021-12-01
/ 化学工业出版社
Product Details 基本信息 ISBN-13 书号 9787122394842 Author 作者 马盛林(Shenglin Ma)、金玉丰(Yufeng Jin) 著 Format 版本 精装 Pages Number 页数 273页 Publisher 出版社 化学工业出版社 Publication Date 出版日期 2021-12-01 Product Dimensions 商品尺寸 16开 Language 语种 其它(含多语) Book Contents 内容简介 三维射频集成应用是硅通孔(TSV)三维集成技术的重要应用发展方向。随着5G与毫米波应用的兴起,基于高阻硅TSV晶圆级封装的薄膜体声波谐振器(FBAR) 器件、射频微电子机械系统(RF MEMS)开关器件等逐渐实现商业化应用,TSV三维异质射频集成逐渐成为优选电子信息装备领域工程化应用的关键技术。本书全面阐述面向三维射频异质集成应用的高阻硅TSV转接板技术,包括设计、工艺、电学特性评估与优化等研究,从TSV、共面波导传输
¥215.00
【预订】Magnesium Alloys as Degradable Biomaterials 978036757550
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/ 2020-06-30
Product Details 基本信息 ISBN-13 书号 9780367575502 Author 作者 Yufeng Zheng Format 版本 平装-胶订 Pages Number 页数 600页 Publisher 出版社 CRC Press Publication Date 出版日期 2020-06-30 Product Dimensions 商品尺寸 234 x 156 mm (6.14 x 9.21 Shipping Weight 商品重量 1.11 Language 语种 其它(含多语) Book Contents 内容简介 Magnesium Alloys as Degradable Biomaterials provides a comprehensive review of the biomedical applications of biodegradable magnesium and its alloys. Magnesium has seen increasing use in orthopedic and cardiovascular applications over the last decade, particularly for coronary stents and bone implants.The book discusses the basic concepts of biodegradation mechanisms as well as strategies to control biodegradation mode and rate, microstructure, mechanical properties, corrosion resistance to body fluid, andin vitro andin vivo biocompatibility.The recently devel
¥599.00
预售 按需印刷 Technology Leadership for Innovation in Hi高等教育创新的技术领
北京发货,付款后10天内发货
/ 2019-02-15
/ IGI出版社
¥1074
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先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
新华书店正版,关注店铺成为会员可享店铺专属优惠,团购客户请咨询在线客服!
/ 2021-12-01
/ 化学工业出版社
三维射频集成应用是硅通孔(TSV)三维集成技术重要应用发展方向。随着5G与毫米波应用的兴起,基于高阻硅TSV晶圆级封装的FBAR器件、RF MEMS开关器件、基于TGV的滤波器等逐渐实现商业化应用,TSV三维异质射频集成逐渐成为优选电子信息装备领域工程化应用的关键技术。1. 本书全面阐述面向三维射频异质集成应用的高阻硅TSV转接板技术,包括设计、工艺、电学特性评估与优化等研究,从TSV、CPW等基本单元结构入手,到IPD元件以及集成样机,探讨金属化对高频特性的影响规律;2. 展示基于高阻硅TSV的集成电感、微带交指滤波器、天线等IPD元件;3. 详细介绍了2.5D集成四通道L波段接收组件、5-10GHz信道化变频接收机、集成微流道散热的2-6GHz GaN PA 模块等研究案例。4. 本书也系统综述了高阻硅TSV三维射频集成技术的国内外研究进展,并做了详细的对比分析与归纳总结。5. 本书
¥190.70定价:¥298.00(6.4折)
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先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
/ 2021-12-01
/ 化学工业
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先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
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/ 2021-12-01
/ 化学工业出版社
三维射频集成应用是硅通孔(TSV)三维集成技术重要应用发展方向。随着5G与毫米波应用的兴起,基于高阻硅TSV晶圆级封装的FBAR器件、RF MEMS开关器件、基于TGV的滤波器等逐渐实现商业化应用,TSV三维异质射频集成逐渐成为优选电子信息装备领域工程化应用的关键技术。1. 本书全面阐述面向三维射频异质集成应用的高阻硅TSV转接板技术,包括设计、工艺、电学特性评估与优化等研究,从TSV、CPW等基本单元结构入手,到IPD元件以及集成样机,探讨金属化对高频特性的影响规律;2. 展示基于高阻硅TSV的集成电感、微带交指滤波器、天线等IPD元件;3. 详细介绍了2.5D集成四通道L波段接收组件、5-10GHz信道化变频接收机、集成微流道散热的2-6GHz GaN PA 模块等研究案例。4. 本书也系统综述了高阻硅TSV三维射频集成技术的国内外研究进展,并做了详细的对比分析与归纳总结。5. 本书
¥205.60定价:¥298.00(6.9折)
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先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
/ 2021-12-01
/ 化学工业
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先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
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/ 2021-12-01
/ 化学工业出版社
三维射频集成应用是硅通孔(TSV)三维集成技术重要应用发展方向。随着5G与毫米波应用的兴起,基于高阻硅TSV晶圆级封装的FBAR器件、RF MEMS开关器件、基于TGV的滤波器等逐渐实现商业化应用,TSV三维异质射频集成逐渐成为优选电子信息装备领域工程化应用的关键技术。1. 本书全面阐述面向三维射频异质集成应用的高阻硅TSV转接板技术,包括设计、工艺、电学特性评估与优化等研究,从TSV、CPW等基本单元结构入手,到IPD元件以及集成样机,探讨金属化对高频特性的影响规律;2. 展示基于高阻硅TSV的集成电感、微带交指滤波器、天线等IPD元件;3. 详细介绍了2.5D集成四通道L波段接收组件、5-10GHz信道化变频接收机、集成微流道散热的2-6GHz GaN PA 模块等研究案例。4. 本书也系统综述了高阻硅TSV三维射频集成技术的国内外研究进展,并做了详细的对比分析与归纳总结。5. 本书
¥184.80定价:¥298.00(6.21折)
先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Interposer Tech
新华书店正版,关注店铺成为会员可享店铺专属优惠,团购客户请咨询在线客服!
/ 2021-12-01
/ 化学工业出版社
三维射频集成应用是硅通孔(TSV)三维集成技术重要应用发展方向。随着5G与毫米波应用的兴起,基于高阻硅TSV晶圆级封装的FBAR器件、RF MEMS开关器件、基于TGV的滤波器等逐渐实现商业化应用,TSV三维异质射频集成逐渐成为优选电子信息装备领域工程化应用的关键技术。1. 本书全面阐述面向三维射频异质集成应用的高阻硅TSV转接板技术,包括设计、工艺、电学特性评估与优化等研究,从TSV、CPW等基本单元结构入手,到IPD元件以及集成样机,探讨金属化对高频特性的影响规律;2. 展示基于高阻硅TSV的集成电感、微带交指滤波器、天线等IPD元件;3. 详细介绍了2.5D集成四通道L波段接收组件、5-10GHz信道化变频接收机、集成微流道散热的2-6GHz GaN PA 模块等研究案例。4. 本书也系统综述了高阻硅TSV三维射频集成技术的国内外研究进展,并做了详细的对比分析与归纳总结。5. 本书
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/ 2021-12-01
/ 化学工业
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先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Inter
/ 2021-12-01
/ 化学工业
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【新华书店自营店】 先进电子封装技术与关键材料丛书--TSV 3D RF Integration:HR-Si Inter
全国五仓就近发货80%城市次日达!提供电子发票!
/ 2021-12-01
/ 化学工业出版社
三维射频集成应用是硅通孔(TSV)三维集成技术重要应用发展方向。随着5G与毫米波应用的兴起,基于高阻硅TSV晶圆级封装的FBAR器件、RF MEMS开关器件、基于TGV的滤波器等逐渐实现商业化应用,TSV三维异质射频集成逐渐成为优选电子信息装备领域工程化应用的关键技术。1. 本书全面阐述面向三维射频异质集成应用的高阻硅TSV转接板技术,包括设计、工艺、电学特性评估与优化等研究,从TSV、CPW
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